PCB Manufacturing, PCBA Assembly & Box Build EMS Solutions

HCJMPCBA Capabilities

Comprehensive PCB Manufacturing, PCBA Assembly & Box Build EMS Solutions

PCB Manufacturing Capabilities: Precision & Versatility Across Substrate Types

HCJMPCBA’s PCB manufacturing capabilities cover a full spectrum of substrate materials and configurations, engineered to meet the most demanding technical requirements. We adhere to global standards (IPC-6012, IPC-6019) and optimize processes for thermal performance, durability, and cost-effectiveness.

1.1 Core PCB Manufacturing Scope

We specialize in seven key PCB types, each tailored to specific application needs:

Rigid PCB (standard & high-density)
Flexible PCB (PI-based, for compact/complex layouts)
Rigid-Flex PCB (hybrid design for space-constrained devices)
Ceramic PCB (AlN/Al₂O₃/Si₃N₄, for high-temperature/high-power applications)
Aluminum Substrate PCB (for thermal management in LED/automotive electronics)
HDI PCB (high-density interconnect, for miniaturized devices)
High-Frequency PCB (Rogers RO4003C/RO5880, for 5G/telecom equipment)

1.2 Key Process Parameters (Quantified Specifications)

PCB Type	Layer Count	Line Width/Spacing	Minimum Hole Size	Thermal Conductivity	Operating Temperature Range	Compliant Standards
Rigid PCB	2–32 Layers	3/3 mil (0.076/0.076mm)	0.1mm (4mil)	0.3 W/m·K	-40℃ ~ +125℃	IPC-6012 Class II/III
Ceramic PCB (AlN)	1–8 Layers	4/4 mil (0.102/0.102mm)	0.2mm (8mil)	≥170 W/m·K	-200℃ ~ +1900℃	IPC-6019, MIL-PRF-32535
Aluminum Substrate PCB	1–4 Layers	5/5 mil (0.127/0.127mm)	0.3mm (12mil)	≥2 W/m·K	-40℃ ~ +125℃	IPC-2221, IEC 61249
HDI PCB	4–20 Layers	2/2 mil (0.051/0.051mm)	0.1mm (4mil)	0.3 W/m·K	-40℃ ~ +125℃	IPC-6012, IPC-6018
Flexible PCB	1–8 Layers	3/3 mil (0.076/0.076mm)	0.1mm (4mil)	0.25 W/m·K	-55℃ ~ +125℃	IPC-6013, IEC 62386
High-Frequency PCB (Rogers)	2–12 Layers	3/3 mil (0.076/0.076mm)	0.15mm (6mil)	0.4 W/m·K	-40℃ ~ +150℃	IPC-6012, Rogers Specs

1.3 Material Selection & Compatibility

We source premium materials from trusted global suppliers to ensure performance and reliability:

Rigid PCB: FR-4 (Tg 140℃/150℃/170℃/180℃), high-Tg FR-4 for industrial applications, halogen-free FR-4 (RoHS compliant).
Ceramic PCB: Aluminum Nitride (AlN), Aluminum Oxide (Al₂O₃), Silicon Nitride (Si₃N₄) for extreme environments.
Thermal Substrates: Aluminum (1060/6061 alloy), copper-core substrates for high-power devices.
High-Frequency Materials: Rogers RO4003C, RO5880, RO3010, and Arlon AD250 for 5G, radar, and telecom equipment.
Flexible PCB: Polyimide (PI) film (Kapton®), LCP (Liquid Crystal Polymer) for high-temperature flex applications.

1.4 Industry Applications

Ceramic PCB: Aerospace sensors, high-power RF modules, semiconductor test equipment.
Aluminum Substrate: High-power LEDs, automotive lighting, power inverters.
HDI PCB: Smartphones, wearables, medical diagnostic devices.
High-Frequency PCB: 5G base stations, satellite communication systems, radar modules.

PCBA Assembly Capabilities: Precision & Reliability for Complex Designs

HCJMPCBA’s PCBA assembly capabilities combine advanced automation, strict quality control, and compliance with global standards to deliver consistent results—from micro-components (01005) to complex BGA/QFN packages.

2.1 Core Assembly Services

SMT Assembly: Surface-mount technology for miniaturized components, high-density layouts.
Through-Hole Assembly (THT): For power components, connectors, and devices requiring mechanical stability.
Hybrid Assembly: Combined SMT + THT for mixed-component designs (e.g., industrial controllers).
BGA/QFN Assembly: Fine-pitch ball grid array and quad flat no-lead packages, critical for high-performance ICs.
Micro-Assembly: Handling ultra-small components (01005, 0201) for compact consumer electronics.

2.2 Key Technical Parameters

Assembly Type	Component Range	Placement Accuracy	Soldering Process	Core Performance Metrics	Compliant Standards
SMT Assembly	01005 (0.4×0.2mm) ~ 50×50mm	±0.01mm (high-precision); ±0.025mm (high-speed)	8-zone reflow soldering (nitrogen option)	50,000 components/hour; first-pass yield ≥99.8%	IPC-A-610 Class II/III, IPC-J-STD-001
BGA Assembly	0.4mm pitch ~ 25×25mm	±0.005mm	Nitrogen/vacuum reflow soldering	Void rate ≤25% (IPC-7095); X-ray inspection 100%	IPC-7095, IPC-A-610 Class III
Through-Hole Assembly	AWG 20~30 wires; DIP components	±0.1mm	Wave soldering; selective soldering (for complex THT)	Flux residue <0.1mg/in²; solder joint strength ≥80N	IPC-J-STD-001, IPC-A-610 Class II
Micro-Assembly	01005, 0201 components; fine-pitch QFN	±0.008mm	High-precision reflow soldering	Component damage rate ≤0.05%	IPC-A-610 Class III, IPC-J-STD-001

2.3 Soldering Process Details

Solder Material: Lead-free solder (Sn96.5Ag3.0Cu0.5) compliant with RoHS 2.0; leaded solder (Sn63Pb37) available for military/aerospace applications.
Nitrogen Reflow: 99.99% nitrogen purity reduces oxidation, improving solder joint quality for fine-pitch components.
Vacuum Reflow: For BGA/CSP packages, removes trapped air to minimize voids (void rate ≤25%).
Wave Soldering: Temperature-controlled (255±5℃) with preheat zone (150–180℃) to ensure uniform soldering of THT components.

2.4 Quality Control for Assembly

SPI (Solder Paste Inspection): Checks paste thickness (0.10–0.15mm) and uniformity, defect detection rate ≥99.5%.
AOI (Automated Optical Inspection): 100% coverage for component placement, polarity, and solder joint defects; resolution 0.05mm.
X-ray Inspection: For BGA/QFN w
elding spot (1μm precision) and hidden joints; 3D X-ray option for complex packages.
Manual Inspection: For low-volume or custom designs, performed by IPC-A-610 certified technicians.

Box Build & Electronics Integration Capabilities: Turnkey Solutions

HCJMPCBA’s Box Build EMS capabilities integrate PCB assembly, component sourcing, mechanical integration, and testing into a single, seamless solution—delivering fully functional electronic devices ready for deployment.

3.1 Core Integration Services

Our end-to-end Box Build services cover:

PCB assembly (SMT/THT/BGA)
Component sourcing (electronics, structural parts, cables)
Cable harnessing (crimping, welding, labeling for AWG 20~30)
Mechanical integration (enclosure assembly, heat sink mounting, hardware installation)
Waterproof/dustproof treatment (IP65/IP67 rating)
Functional & environmental testing
Custom packaging (anti-static, industrial, medical-grade)

3.2 Key Performance Parameters

Integration Precision: Structural component tolerance ±0.1mm; cable crimping force ≥80N (IPC-A-620 compliant).
Thermal Management: Aluminum heat sinks (thermal conductivity ≥200W/m·K), heat pipes (thermal resistance ≤0.2℃/W), and thermal interface materials (TIM) for high-power devices.
Protection Ratings: IP65 (industrial environments) and IP67 (automotive/outdoor applications); custom ratings available.
Cable Harnessing: Wire stripping length 5–8mm; insulation resistance ≥100MΩ; voltage rating up to 600V.

3.3 Box Build Integration Process

Process Step	Key Activities	Quality Checkpoints	Cycle Time (Per Unit)
1. Requirement Analysis	Define integration scope, standards, and testing needs	Signed requirement document	1–2 Business Days
2. Component Sourcing	Source PCBs, components, enclosures, and cables	IQC inspection (qualified rate≥99.9%)	3–7 Business Days
3. PCB Assembly	SMT/THT/BGA assembly + AOI/X-ray inspection	First-pass yield ≥99.8%	1–3 Business Days
4. Mechanical Integration	Enclosure assembly, heat sink mounting, cable routing	Fit tolerance ±0.1mm; heat sink fit rate ≥95%	0.5–2 Hours
5. Testing	Functional + environmental testing (as required)	Test pass rate ≥99.5%	0.2–1 Hour
6. Packaging & Delivery	Custom packaging + labeling + shipping	Packaging integrity check	1–2 Business Days

3.4 Typical Applications

Industrial control systems (PLCs, HMIs, sensors)
Medical devices (diagnostic equipment, patient monitors)
Automotive electronics (onboard controllers, infotainment systems)
Consumer electronics (smart home devices, wearable tech)

Testing & Quality Assurance Capabilities: Compliance & Reliability

HCJMPCBA’s testing and quality assurance capabilities ensure every product meets technical specifications, industry standards, and customer expectations—with a defect rate ≤500ppm.

4.1 Comprehensive Testing Services

Electrical Testing

ICT (In-Circuit Testing): 100% coverage for component continuity, short circuits, and parametric values; test time ≤30 seconds/unit.
FCT (Functional Testing): Customized test fixtures for verifying device performance (e.g., voltage output, signal transmission, user interface); test coverage 100%.
Boundary Scan Testing: For complex PCBs with JTAG-compliant components (e.g., BGA, FPGA); detects interconnections and component defects.

Reliability Testing

Temperature-Humidity Cycling: -40℃ ~ +125℃, 500 cycles (1 cycle = 24 hours); no performance degradation allowed.
Vibration Testing: 10–2000Hz frequency, 10g acceleration (IEC 60068-2-6); no mechanical damage or functional failure.
Salt Spray Testing: 5% NaCl solution, 500 hours (ASTM B117); no corrosion on metal components.
ESD Protection Testing: ±100V contact discharge, ±200V air discharge (IEC 61000-4-2); no permanent damage.

Specialized Testing

BGA X-ray Inspection: 3D imaging for void detection (void rate ≤25%) and solder joint integrity.
PCB Warpage Testing: Warpage ≤0.75% (IPC-6012); measured via laser scanning.
Solder Joint Strength Testing: Pull force ≥80N for THT components, ≥30N for SMT components (IPC-J-STD-001).

4.2 Three-Stage Quality Control System

IQC (Incoming Quality Control): Inspect PCBs, components, and structural parts before production.
- PCB: Warpage ≤0.75%, surface cleanliness ≥99.5%, trace width tolerance ±10%.
- Components: Authenticity verification, solderability ≥95% (IPC-J-STD-002), no visual defects.
IPQC (In-Process Quality Control): Monitor production stages with scheduled inspections.
- First Article Inspection (FAI): 100% check of the first unit for each order.
  
  – Inspection Frequency: Every 2 hours for mass production; 100% inspection for critical processes (BGA assembly, cable crimping).
FQC (Final Quality Control): Comprehensive inspection of finished products.
- Functional testing + visual inspection + packaging check.
- Defect rate ≤500ppm; non-conforming products are reworked or rejected.

4.3 Compliance Certifications

We hold global certifications to meet industry-specific requirements:

ISO 9001: General quality management system.
ISO 13485: Medical device manufacturing (compliant with FDA 21 CFR Part 820).
IATF 16949: Automotive electronics manufacturing (compliant with AEC-Q100/Q200).
RoHS 2.0: Restriction of hazardous substances (Pb, Cd, Hg, etc.).
REACH: Compliance with EU chemical regulations.

Industry-Specific Capabilities: Tailored Solutions for Key Sectors

HCJMPCBA’s capabilities are optimized for the unique requirements of medical, automotive, industrial, and consumer electronics—combining technical precision, compliance, and industry expertise.

5.1 Medical Device PCB/PCBA Capabilities

Core Compliance: ISO 13485, FDA 21 CFR Part 820, IPC-A-610 Class III.
Key Features:
- Biocompatible materials (ISO 10993 certified) for patient-contact devices.
- Cleanroom manufacturing (Class 8) to minimize contamination.
- Traceability: Lot numbers for all components, full production records (retained for 10 years).
- Low-noise designs for sensitive diagnostic equipment.
Applications: Diagnostic scanners, patient monitors, infusion pumps, wearable health trackers.

5.2 Automotive Electronics Capabilities

Core Compliance: IATF 16949, AEC-Q100/Q200, ISO 16750.
Key Features:
- Wide temperature range (-40℃ ~ +125℃) for under-hood and cabin applications.
- Vibration resistance (10–2000Hz, 5g) and IP67 waterproof rating.
- High-reliability components (MTBF ≥100,000 hours).
- Lead-free soldering (Sn96.5Ag3.0Cu0.5) compliant with ELV regulations.
Applications: Onboard controllers, LED headlights, EV power modules, infotainment systems.

5.3 Industrial Control Capabilities

Core Compliance: IEC 61010, IPC-A-610 Class II, ISO 9001.
Key Features:
- High-Tg materials (Tg ≥170℃) for long-term operation in harsh environments.
- Conformal Coating (IPC-CC-830) for dust, moisture, and chemical resistance.
- EMI shielding to prevent interference with other industrial equipment.
- Extended lifespan (10+ years) with robust component selection.
Applications: PLCs, industrial sensors, motor drives, factory automation systems.

5.4 Consumer Electronics Capabilities

Core Compliance: RoHS 2.0, CE, FCC.
Key Features:
- HDI and miniaturized designs (board thickness 0.2mm) for compact devices.
- Cost optimization via bulk sourcing and efficient manufacturing.
- Fast turnaround for time-sensitive product launches.
- Customizable packaging and branding.
Applications: Smartphones, tablets, wearables, smart home devices, routers.

Production & Delivery Capabilities: Scalability & Speed

HCJMPCBA’s production capabilities adapt to your volume needs—from rapid prototypes to high-volume production—with reliable lead times and global delivery.

6.1 Production Volume Adaptability

Production Type</	Volume Range</	Lead Time</	Key Advantages</
Prototype	1–10 Units	24–48 Hours(expedited); 3–5 Days (standard)	Fast turnaround for design validation
Low-Volume Production	10–500 Units	7–12 Days	Flexible customization, no minimum order
Medium-Volume Production	500–10,000 Units	12–18 Days	Balanced cost and speed
High-Volume Production	10,000+ Units	15–25 Days	Bulk pricing, dedicated production lines

6.2 Expedited Service

Prototype expedited: 24–48 hour delivery for PCB/PCBA prototypes (requires error-free files and in-stock components).
Low-Volume expedited: 5–7 days for 10–500 units (priority production line allocation).
Rush Fees: 30–50% premium on standard pricing (varies by volume and complexity).

6.3 Supply Chain & Logistics

Supplier Network: 400+ qualified global suppliers for components, materials, and structural parts; procurement lead time stability ≥98%.
Component Management: Obsolete component replacement (fast validation of drop-in alternatives) and long-lead-time component pre-stocking.
Global Delivery: Partner with DHL, FedEx, and ocean freight carriers; door-to-door delivery to 100+ countries.
Customs Compliance: Support for export documentation (commercial invoice, packing list, certificate of origin, compliance certificates).

Value-Added Capabilities: Beyond Manufacturing

HCJMPCBA offers value-added services to streamline your workflow, reduce costs, and ensure project success—from design to delivery.

7.1 Technical Support Services

Free DFM (Design for Manufacturability) Analysis: Review your PCB/PCBA designs to optimize for manufacturing, reduce defects, and lower costs.
- Key checks: Component footprint compatibility, trace width/spacing, via size, solder mask coverage.
- Delivery: Detailed DFM report within 24–48 hours of file submission.
Design Optimization: Recommendations for thermal management, EMI reduction, and assembly efficiency.
Technical Consultation: 24-hour support from IPC-certified engineers for design, material, and process questions.

7.2 Supply Chain Services

Component Sourcing: Global procurement of electronic components, structural parts, and cables—with cost savings of 15–25% via bulk purchasing.
Obsolete Component Management: Proactive alerts for end-of-life (EOL) components; fast identification and validation of drop-in alternatives.
BOM Optimization: Reduce costs by replacing high-cost components with compatible, lower-cost alternatives (without compromising performance).
Component Storage: Secure storage of long-lead-time or high-value components (temperature-controlled, anti-static facilities).

7.3 Project Management Services

End-to-End Project Tracking: Real-time visibility into production progress, testing results, and shipping status via our online portal.
Dedicated Project Managers: Single point of contact for all project-related communications (quotes, updates, issue resolution).
Documentation Delivery: Comprehensive reports including test data, inspection results, compliance certificates, and traceability records.
After-Sales Support: 90-day warranty for all products; free rework for manufacturing defects; technical support for post-delivery issues.

Capabilities Summary: Why Choose HCJMPCBA?

HCJMPCBA’s comprehensive capabilities deliver unmatched value for OEM engineers, procurement teams, and cross-industry clients—combining precision, compliance, scalability, and speed. Our key strengths include:

Full Industry Chain Coverage: From PCB manufacturing and PCBA assembly to Box Build integration and testing—one partner for all your electronics needs.
High-Precision Processes: ±0.01mm SMT placement, BGA void rate ≤25%, structural integration tolerance ±0.1mm—meeting the most demanding technical requirements.
Global Compliance: ISO 9001/13485/IATF 16949 certifications, RoHS 2.0 compliance, and industry-specific standards (medical/automotive) to mitigate risk.
Cross-Industry Expertise: Tailored solutions for medical, automotive, industrial, and consumer electronics—with deep knowledge of sector-specific needs.
Scalable Production: Adaptable to prototypes (24–48 hour delivery) and high-volume production (10k+ units) with reliable lead times.
Value-Added Services: Free DFM analysis, BOM optimization, and 24-hour technical support—reducing costs and streamlining workflows.