Description

[Product Definition]

Professional PCBA (Printed Circuit Board Assembly) integrates electronic components such as resistors/capacitors/chips onto customized PCB substrates through surface mount (SMT) and through-hole insertion technologies. As the core functional carrier of electronic products, we provide a full-process solution from multilayer PCB design to HDI high-density interconnection, rigid-flex PCB manufacturing, supporting one-stop services from prototype development to mass production.

• Substrate Innovation
• Adopting FR4, metal-based (IMS), and polyimide flexible substrates
• Supporting 1-40 layers of multilayer boards with a minimum line width/line spacing of 3mil/3mil
• Implementing surface treatment processes such as OSP, electroless nickel gold plating, and immersion silver plating

• SMT placement: DEK printer + Panasonic high-speed mounter, supporting 01005 components
• Welding technology: nitrogen reflow soldering (TAL≥95%) + selective wave soldering
• Special processes: laser welding, underfill, and three-proof coating

• Meet IPC-A-610 Class III assembly standard
• 100% X-Ray inspection + 3D AOI for BGA solder joints
• Reliability test: Temperature and humidity cycling / Vibration shock / Salt spray test

• Active components (ICs, transistors) perform logical operations / signal amplification
• Passive components (R/C/L) achieve filtering / energy storage / impedance matching
• The multilayer board stacking structure optimizes EMI shielding and heat dissipation efficiency

• Smartphone motherboard: Supports 5G baseband chip mounting and realizes eMMC/UFS storage expansion
• Smart wearable device: Flexible PCB design, passes IP68 waterproof test
• Home appliance control board: Modular design supports OTA firmware upgrade

• 5G base station backplane: 8-layer HDI board, supports 25Gbps signal transmission
• Optical module PCBA: 100G QSFP28 packaging, BER≤1e-12
• Industrial router: Reliability verification in wide temperature range (-40℃~+85℃)

• Diagnostic equipment motherboard: Complies with ISO 13485 standard and supports medical-grade sterilization treatment.
• Implantable device circuit: Biocompatible coating and certified by USP Class VI.
• Wearable monitor: Flexible sensor interface design and supports multi-parameter monitoring of ECG/SpO2.

• ADAS control board: Automotive-grade AEC-Q100 certification, supports -40℃~+125℃ operation
• Power battery management system (BMS): 128-channel voltage acquisition, accuracy ±0.1%
• In-vehicle infotainment system: Supports Android Auto/CarPlay dual protocols

• Servo driver: Multi-layer PCB heat dissipation design, supports 20kHz PWM frequency
• IoT gateway: M.2 interface expansion, supports LTE/5G multi-mode communication
• Intelligent instrument: Integrated RS485/

• Prototype development: Rapid prototyping within 72 hours, supporting DFM manufacturability analysis.
• Material management: Just-in-time delivery, providing RoHS/REACH compliance certificates.
• Testing solution: FCT functional testing + Burn-in aging test, MTBF≥100,000 hours.